nepes

Nepes is a South Korean corporation specializing in providing bumping and wafer-level package OSAT manufacturing services for Fabless and IDM customers worldwide since 1990. Nepes offers a turn-key solution of IC back-end service for 8″ and 12″ wafers, implementing mainstream technology from wafer bumping to IC packaging and testing. Their portfolio includes Wafer level package (WLP), System in package (SiP) and Fan-out panel level package (FOPLP). With manufacturing sites in South Korea, Philippines, and China, and international sales offices in San Diego, CA, Shanghai, China, and Taiwan, Nepes has established a global presence. The company received a Private Equity Round investment from EastBridge Partners on January 1, 2012. Nepes operates in the Manufacturing and Semiconductor industries, demonstrating its expertise in advanced back-end foundry technologies.