FlipChip International (FCI) provides turnkey semiconductor assembly and test services to the consumer, automotive, aerospace, and medical industries through its leadership in high volume wafer level packaging and advanced packaging technologies. Established in 1996, FCI has been an early developer of Wafer-Level Chip Scale Packaging and remains the technology leader in this field with patented technologies such as Cu Pillar Bumping, Spheron™ WLCSP, ChipsetT™ Embedded Die Packaging, and FlipChip on Leadframe assembly. FCI supports a wide range of customers from each industry, frequently partnering with them to engineer customized solutions. The company has a global footprint, offering high volume advanced packaging services from ISO/TS 16949-certified factories located in Phoenix, Arizona, USA, and Shanghai, China. With a primary focus on the Information Technology sector, FCI has extensive experience and expertise in serving diverse industries.
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