NANIUM S.A., established in 2010, is a key player in the semiconductor industry, focusing on innovation in semiconductor assembly and packaging. The company's slogan, "Leading innovation in semiconductor assembly and packaging, providing comprehensive, tailored solutions from design to market delivery," reflects its commitment to delivering customized solutions. NANIUM specializes in 300mm Wafer-Level Packaging, particularly in Fan-In/WLCSP and Fan-Out/WLFO technologies, showcasing its expertise in the field. With its headquarters near Porto, Portugal, and additional offices in Dresden, Germany, and Boston, USA, NANIUM has a strategic global presence that enhances its accessibility to key markets while catering to diverse customer needs. The company offers a broad spectrum of services including semiconductor assembly, packaging, testing, engineering, and manufacturing, making it a comprehensive one-stop solution for clients. NANIUM's capability to cover the entire development chain from design to various Wafer-Level Packaging techniques demonstrates its dedication to delivering high-quality and customized solutions. As a prominent figure in the manufacturing and semiconductor industries, NANIUM has positioned itself as a premier service provider, equipped to meet the most stringent customer requirements. Although specific details regarding the last investment and investors are not available, NANIUM's commitment to innovation and comprehensive solutions is evident, positioning it as an attractive prospect for potential investors in the semiconductor and manufacturing sectors.
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