Beckermus Technologies

Providing Micro Assembly services: Microelectronics, Electro Optics and Photonics Assembly

General Information
Company Name
Beckermus Technologies
Founded Year
1998
Location (Offices)
Israel +1
Founders / Decision Makers
Number of Employees
9
Industries
Design, Manufacturing
Funding Stage
-
Social Media

Beckermus Technologies - Company Profile

Beckermus Technologies is an Israeli-based manufacturing startup that specializes in providing micro assembly services in the fields of microelectronics, electro optics, and photonics assembly. Founded in 1998 by the Beckermus brothers, Oded and Oren, the company's primary focus has been on creating an Excellence Center in the field of "Bare Die" assembly services.

The company has kept pace with the growth of the local startup community and the expansion of global corporate activity in Israel. With a versatile client base ranging from R&D/NPI to High Volume production, the company is well-positioned for worldwide expansion. Beckermus Technologies prides itself on offering services globally while consistently maintaining high-quality standards, quick response times, and reasonable pricing.

Beckermus Technologies operates within a 750 sqm cleanroom facility for prototyping and low-medium volume production, while mass production is carried out in partnership with facilities in the far-east and Europe. The company's main services include wire bonding, encapsulation, active alignment, IC packaging, and various other micro assembly services. Beckermus holds several quality standards certifications, including ISO 13485 for medical devices, IPC-A-610, AS9100D aerospace, MILL-STD 883, and QMS certified.

As of now, there is no publicly disclosed information regarding the company's last investment or its investors. Nevertheless, Beckermus Technologies stands as a promising player in the micro assembly services industry, leveraging its years of experience and expertise to meet the evolving demands of the global market.

Taxonomy: Microelectronics, Electro Optics, Photonics Assembly, Bare Die Assembly, Wire Bonding, IC Packaging, Flip Chip, Wafer Level Packaging, Quality Standards Certification, MEMS Assembly, Encapsulation, Active Alignment, Prototype Production, Mass Production, International Expansion

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