Xinde Semiconductor
Advance your mobile technology with our comprehensive semiconductor packaging and testing solutions.
Advance your mobile technology with our comprehensive semiconductor packaging and testing solutions.
Xinde Semiconductor, founded in 2020, is revolutionizing the semiconductor industry with its comprehensive packaging and testing solutions. The company's slogan, "Advance your mobile technology with our comprehensive semiconductor packaging and testing solutions," underscores its focus on cutting-edge mobile products. Xinde Semiconductor stands out by providing turnkey high-tech mid- and back-end packaging and testing services. It recently secured a substantial CNY600.00M Venture Round investment on 25 October 2023, with backing from prominent investors such as Panorama Capital, KQ Capital, and SL Capital. As a key player in the semiconductor industry, Xinde Semiconductor is primed to make a significant impact with its innovative technological advancements.
| Funding Stage | Amount | No. Investors | Investors | Date |
|---|---|---|---|---|
| Venture Round | CNY600.00M | 4 |
|
25 Oct 2023 |
| Series A | Unknown | 4 |
|
20 Oct 2021 |
| Series A | Unknown | 2 |
|
01 Aug 2021 |
| Angel Round | Unknown | - | 01 Jan 2021 |
No recent news or press coverage available for Xinde Semiconductor.
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