AmTECH Microelectronics is a contract manufacturing company established in 1993, specializing in complex microelectronics, advanced packaging, and SMT assembly. With a focus on exceeding industry standards, the company aims to be the go-to solution for firms involved in next-generation products and new product introduction. Leveraging the latest in manufacturing automation technology and a team of experienced employees, with over 30 years in the field, AmTECH streamlines the process to deliver quality results. The company boasts ISO 9001: 2015 certification, ITAR registration, and compliance with IPC-A-610 Class 3 workmanship standards. Their offerings cover a wide range of services, including Die Attach, Flip-Chip, Multi-Chip, Gold and Aluminum Wire Bonding, Glob Top, Dam & Fill, Underfill, UV, High Complexity SMT Assembly, and PCB, Rigid-Flex, Flex, Interposer, and Ceramic substrates. Quality systems and equipment include YESTECH Automated Optical Inspection, YXLON-Feinfocus 160kV XRAY System, DAGE Wire Bond Pull and Die Shear Test, MICRO-VU Precision Measuring System, and complete manufacturing documentation. AmTECH's commitment to quality and their investment in state-of-the-art equipment positions them as a reliable partner for companies seeking high-quality microelectronics manufacturing. More information about their services can be found on their website: http://amtechmicro.com/.
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