U-MAP Co., Ltd.
U-MAP is cutting-edge of R&D of thermal additives, who creates a lot of IPs and PoC.
U-MAP is cutting-edge of R&D of thermal additives, who creates a lot of IPs and PoC.
U-MAP Co., Ltd., a materials start-up originating from Nagoya University, is at the forefront of R&D of thermal additives. The company's exclusive core technology, "Thermalnite," addresses thermal issues in electronic devices, crucial for maintaining performance, longevity, and global energy efficiency. Through a robust partnership with Nagoya University, U-MAP has developed cutting-edge functional materials to meet the heat dissipation demands of electronic devices, from smartphones to electric vehicles (EVs). Founded in 2016 and headquartered in Japan, U-MAP secured its Series B investment from Global Brain and EPSON X Investment on 14 December 2022.
| Funding Stage | Amount | No. Investors | Investors | Date |
|---|---|---|---|---|
| Series B - U | Unknown | 2 |
|
14 Dec 2022 |
| Venture Round - U | ¥300.00M | 5 |
|
19 Jun 2020 |
| Series A - U | ¥49.50M | 1 |
|
13 Sep 2018 |
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