Siltectra GmbH

SILTECTRA GmbH, an Infineon Technologies Company, specializes in wafer treatment technologies. The company's patented “Cold Split” process, developed based on research from Harvard, allows for kerf-free wafering and thinning of wafers or other thin substrates made of brittle materials. The latest investment of €3.90M in Series B was secured at 22 December 2017 from MIG AG. The "Cold Split" technology has garnered attention from the photovoltaic (PV) industry for its potential to drive cost savings in cell manufacturing, as it enables the production of silicon wafers without material loss during wire-sawing. Additionally, the compound semiconductors industry, including LED and power electronics sectors, benefits from this eco-friendly technology by reclaiming multiple thin wafers from one thicker wafer or for wafer thinning. The company has expanded its R&D efforts towards very hard materials like silicon carbide, gallium nitride, sapphire, and ceramics, positioning itself as a key player in future semiconductor devices. SILTECTRA’s proven technology is applicable to commonly used semiconductor materials such as silicon, gallium arsenide, and germanium. Their expertise and innovative approach have the potential to significantly reduce substrate costs, making SILTECTRA an enabler for the fast-growing future compound semiconductors and MEMS markets. Founded in 2010, SILTECRA is headquartered in Germany.