Ralink Technology Corporation, founded in 2001, has positioned itself as a leader in wireless chipset solutions, with a strong focus on innovative technologies. The company's slogan, "Leading the future of wireless connectivity with superior throughput, extended range, and reliable performance," reflects its commitment to advancing the wireless industry. Ralink's products, renowned for their superior throughput, extended range, and low-power consumption, are designed to address the needs of various sectors, including Wi-Fi, mobile, and embedded applications. With an emphasis on feature-rich chipsets that offer high integration, the company enables the development of compact and advanced wireless products at a cost-effective price point. Ralink has leveraged patented technologies such as MIMObilityTM and Video TurbineTM to extend the applications of Wi-Fi beyond traditional PC networking to encompass digital multimedia and handheld devices. These devices include cell phones, PDAs, cameras, print servers, HDTV, and video game players. Notably, the company continues to drive advancements in speed, bandwidth, and reliability through its IEEE 802.11n solutions for high-performance Wi-Fi. With its headquarters in HsinChu, Taiwan, an R&D center in Cupertino, California, and sales offices in China, Europe, and Japan, Ralink has established a global presence. In 2013, the company secured a significant Venture Round investment from H&Q Asia Pacific, further aligning itself with investors who recognize its potential in shaping the future of wireless technology. Ralink Technology's dedication to driving wireless connectivity innovation positions it as a compelling candidate for venture capital investment within the mobile industry.
Funding Stage | Amount | No. Investors | Investors | Date |
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Venture Round | Unknown | 1 | H&Q Asia Pacific | 07 Jan 2013 |