PiBond
Lithography and patterning, low-k and optical dielectrics and material packaging for semiconductors and photonics.
Lithography and patterning, low-k and optical dielectrics and material packaging for semiconductors and photonics.
PiBond is a Finland-based startup specializing in lithography and patterning, low-k and optical dielectrics, and material packaging for semiconductors and photonics. Established in 2014, the company has positioned itself as one of the leading providers of ultra-high purity siloxane and metal organic polymer materials for the semiconductor industry. Their products are integral to various applications including integrated circuits, CMOS image sensors, and photolithographic processes.
Having been in the industry for close to a decade, PiBond has been supplying advanced materials for the latest technology nodes. This commitment to innovation and production of enabling products places them at the forefront of the industry's evolution. Whether it's the pursuit of even smaller semiconductor nodes, the advent of 3D-IC packaging, glass and silicon interposers, complex MEMS, or novel display devices, PiBond is dedicated to driving change and progress in the industry.
The company's last private equity round investment took place on 01 January 2015 and was led by AGIC Capital. With a focus on the consumer electronics and manufacturing industries, PiBond is positioned for continued growth and influence in the semiconductor sector.
| Funding Stage | Amount | No. Investors | Investors | Date |
|---|---|---|---|---|
| Private Equity Round | Unknown | 1 |
|
01 Jan 2015 |
No recent news or press coverage available for PiBond.
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