Nextreme Thermal Solutions is a United States-based company founded in 2004, specializing in micro-scale thermal and power management products for various industries, including telecom, consumer, test and measurement, industrial, automotive, and government/aerospace markets. The company was acquired by Laird Technologies in February 2013. Nextreme's patented thin-film embedded cooling technology and power generation capabilities have been integrated into the widely accepted copper pillar bumping process, allowing for easy integration into current design processes and next-generation product designs. The company received a $21.35M Series B investment on 06 August 2008 from prominent investors including In-Q-Tel, 180 Degrees Capital, Chart Venture Partners, Redshift, and RTI International. Nextreme's focus on developing seamless design-in solutions with minimal need for manufacturing changes positions them to revolutionize thermal and power management in the electronics industry. With its innovative products and strong investor backing, Nextreme has the potential to make a significant impact in its target markets.
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