MicroCircuit Laboratories LLC

Hermetic Microelectronic Package Sealing with Low Temperature. Development, Prototype and Automatic Equipment.

General Information
Company Name
MicroCircuit Laboratories LLC
Founded Year
2014
Location (Offices)
Kennett Square, United States +2
Founders / Decision Makers
Number of Employees
1
Industries
Industrial, Manufacturing, Semiconductor
Funding Stage
-
Social Media

MicroCircuit Laboratories LLC - Company Profile

MicroCircuit Laboratories LLC is a pioneering company in the industrial, manufacturing, and semiconductor industries, based in the United States. Established in 2014, the company specializes in hermetic microelectronic package sealing with low temperature, focusing on the development, prototype, and automatic equipment. MCL offers comprehensive encapsulation services, including materials design, process development, testing, prototyping, and production, catering to microelectronic component level hermetic packages. The highlight of MCL's offerings is the Robotic Cover Sealer (RCS), a patent-pending, fully automated cover seal processor. It stands out as the first of its kind in the industry, ensuring perfect seals consistently, irrespective of whether packages and covers are loaded by a human operator or a robot. The RCS is characterized as an intelligent machine, setting a new benchmark in the field. Furthermore, MCL's supported processes encompass both Weld or AuSn solder cover seal, delivering results that surpass all relevant standards including MIL-STD-883 Test Method 1014 Seal, 2009 External Visual, 1009 Salt Atmosphere, 2012 Lid Seal Void Rejection Criteria, and JEDEC JESD9C. Notably, MCL guarantees the longevity of its processes for the life of the package and offers a customer package part number with a $0 license fee. As of the latest available information, there is no record of last investment or last investment investors for MicroCircuit Laboratories LLC. However, the company's innovative approach, focus on automation, and commitment to quality make it a compelling prospect for potential venture capital investment.

Taxonomy: microelectronic packaging, hermetic sealing, low-temperature sealing, encapsulation services, robotic cover sealer, automated equipment, prototype development, MIL-STD-883, process development, materials design, quality standards, AuSn solder sealing, seam weld sealing, production equipment, problem resolution

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