Kandou is a fabless semiconductor company based in Lausanne, Switzerland that has been disrupting the electronics industry since its establishment in 2011. The company is focused on revolutionizing chip-to-chip link solutions, aiming to make devices smaller, more energy efficient, and cost-effective. Kandou's standout technology, the Chord™ signaling, has been integrated into industry specifications by JEDEC and the OIF, showcasing its industry-wide adoption and impact.
The company has recently secured a $72.30M Private Equity Round investment on 24 August 2023, with Climb Ventures joining as the lead investor. This marks a significant milestone for Kandou, emphasizing the confidence investors have in the company's potential and the value it brings to the market.
With its strong IP portfolio and innovative implementations, Kandou is poised to bring about a fundamental shift in interconnect technology, resulting in improved performance and reduced power consumption for chip links. The company's global presence, with offices in Europe, North America, and Asia, showcases its commitment to making a lasting impact on a global scale.
Kandou's dedication to energy, information technology, and manufacturing industries positions it as an influential player in shaping the future of electronics and connectivity. As the company continues to drive innovation and embrace disruptive technology, it is set to unlock new capabilities for customer devices and systems, ultimately contributing to a better-connected world.
Funding Stage | Amount | No. Investors | Investors | Date |
---|---|---|---|---|
Private Equity Round | $72.30M | 1 | 24 Aug 2023 | |
Grant | Unknown | 1 | 28 Apr 2023 | |
Series D | $75.00M | 3 | 16 Dec 2021 | |
Series C | $36.30M | 10 | Fayerweather Fund | 17 Nov 2020 |
Series C | $56.00M | 9 | Fayerweather Fund | 23 Sep 2019 |
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