Kandou

Unlocking the power of your technology

General Information
Company Name
Kandou
Founded Year
2011
Location (Offices)
Lausanne, Switzerland +6
Founders / Decision Makers
Number of Employees
224
Industries
Energy, Information Technology, Manufacturing
Funding Stage
Private Equity
Social Media

Kandou - Company Profile

Kandou is a fabless semiconductor company based in Lausanne, Switzerland that has been disrupting the electronics industry since its establishment in 2011. The company is focused on revolutionizing chip-to-chip link solutions, aiming to make devices smaller, more energy efficient, and cost-effective. Kandou's standout technology, the Chord™ signaling, has been integrated into industry specifications by JEDEC and the OIF, showcasing its industry-wide adoption and impact.

The company has recently secured a $72.30M Private Equity Round investment on 24 August 2023, with Climb Ventures joining as the lead investor. This marks a significant milestone for Kandou, emphasizing the confidence investors have in the company's potential and the value it brings to the market.

With its strong IP portfolio and innovative implementations, Kandou is poised to bring about a fundamental shift in interconnect technology, resulting in improved performance and reduced power consumption for chip links. The company's global presence, with offices in Europe, North America, and Asia, showcases its commitment to making a lasting impact on a global scale.

Kandou's dedication to energy, information technology, and manufacturing industries positions it as an influential player in shaping the future of electronics and connectivity. As the company continues to drive innovation and embrace disruptive technology, it is set to unlock new capabilities for customer devices and systems, ultimately contributing to a better-connected world.

Taxonomy: semiconductor industry, chip-to-chip link solutions, high-speed technology, energy-efficient technology, fabless semiconductor company, Chord signaling, IP portfolio, electronics industry, interconnect technology, innovative leader, JEDEC specifications, OIF specifications, global offices, licensing and standard products, Swiss technology company

Funding Rounds & Investors of Kandou (12)

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Funding Stage Amount No. Investors Investors Date
Private Equity Round $72.30M 1 24 Aug 2023
Grant Unknown 1 28 Apr 2023
Series D $75.00M 3 16 Dec 2021
Series C $36.30M 10 Fayerweather Fund 17 Nov 2020
Series C $56.00M 9 Fayerweather Fund 23 Sep 2019

View All 12 Funding Rounds

Latest News of Kandou

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No recent news or press coverage available for Kandou.

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