IceMOS Technology Corporation is a company that specializes in providing thick film bonded SOI (silicon on insulator) wafers. The company offers bonded SOI wafers, Si-Si bonded wafers, customized engineered substrate solutions, and wafer interconnect technology. Additionally, they offer foundry services including IC processing services and MEMS or MST (microsystems technology) processing services. The products are utilized in various applications including telecommunications products, optical devices, dielectrically isolated integrated circuits, solid state relays, and micromachined components for sensors and actuators. IceMOS Technology Corporation serves industries such as telecommunications, automotive, entertainment, medical, and instrumentation. Founded in 2003, the company is headquartered in Belfast, United Kingdom. The company received a $2.04M Venture Round investment on 07 February 2011. IceMOS Technology Corporation has been providing innovative bonded SOI wafers and advanced substrate solutions for key sectors like telecommunications, automotive, and medical since 2003.
Funding Stage | Amount | No. Investors | Investors | Date |
---|---|---|---|---|
Venture Round | $2.04M | - | 07 Feb 2011 |
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