Henan Union Precision Material Co.,Ltd.

Main products: micron diamond powder, detonated nano diamond , poly diamond powder and diamond slurry !

General Information
Company Name
Henan Union Precision Material Co.,Ltd.
Founded Year
2002
Location (Offices)
Zhengzhou, China +1
Founders / Decision Makers
Number of Employees
5
Industries
Design, Industrial, Manufacturing +1
Funding Stage
-
Social Media

Henan Union Precision Material Co.,Ltd. - Company Profile

Henan Union Precision Material Co.,Ltd. (formerly known as Henan Union Abrasives Corp.) specializes in the research, development, and production of super-hard and super-precise abrasive and polishing materials. Recognized as a High-Tech enterprise by the Henan Provincial Government, the company has garnered praise for its efficient management, professional team, quality products, and excellent customer service since its establishment in 2002.

The company's commitment lies in providing high-end super-precise abrasive materials, products, and complete surface treatment plans. With a dedicated nano diamond production line and China's first research center for nano diamond powders, Henan Union Precision Material Co.,Ltd. possesses key technologies and patents in particle control and dispersion.

Specializing in diamond at nano, submicron, and micron grades, as-grown diamond, and related products, the company's offerings find applications in various high-end surface treatment fields, including LED sapphire wafer processing, semiconductor technology, HDD, optical fibers, IC, and precise optical glasses.

Certified with ISO 9001/14001 and OHSAS18001 systems, the company's commitment to quality and innovation is evident. While the headquarters and last investment details are not available, Henan Union Precision Material Co.,Ltd. presents an intriguing prospect for potential investors in the design, industrial, manufacturing, and semiconductor industries.

Taxonomy: super-hard materials, super-precise abrasive, polycrystalline diamond powder, detonated nano diamond, surface treatment, micron diamond powder, nanotechnology, semiconductor processing, optical glass, LED sapphire wafer, HDD magnetic heads, 3rd generation semiconductor, precision mechanical finishing, diamond wire production, PDC cutter

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