HaiLa
Ultra Low Power RF
Ultra Low Power RF
HaiLa is a Canadian semiconductor startup founded in 2017, focusing on ultra low power wireless connectivity. The company's wireless solution is designed to operate with existing infrastructure, making it protocol compatible and requiring no new infrastructure. Their initial chips are geared towards Wi-Fi 2.4 GHz for IoT applications. This promising startup recently received a substantial $10.35M Venture Round investment on 11 October 2023. The investors involved in this round include Chrysalix, TandemLaunch, Ecofuel Fund, Stanford University, and Murata Electronics (Finland). HaiLa's innovative approach to ultra low power RF technology, coupled with strong investor support, positions the company favorably within the semiconductor and IoT landscapes. This latest investment round is indicative of the market's confidence in HaiLa's potential for disruption and growth.
| Funding Stage | Amount | No. Investors | Investors | Date |
|---|---|---|---|---|
| Venture Round | $10.35M | 5 |
|
11 Oct 2023 |
| Grant | $500.00K | 1 | Government Of Quebec | 29 Aug 2023 |
| Grant | $3.00M | 1 |
|
13 Aug 2021 |
| Seed Round | $3.70M | 3 |
|
26 May 2020 |
| Grant | €100.00K | 1 | Nokia | 21 Nov 2019 |
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