Boschman Advanced Packaging Technology

Boschman Advanced Packaging Technology is a semiconductor assembly solution company, headquartered in The Netherlands and founded in 1987. The company specializes in providing quality solutions for specific market segments such as Mems & Sensors, Smartcards, and Powers. They have expertise in molding and Ag-Sinter systems and boast a modern, well-equipped facility in The Netherlands. The company's systems R&D facility in The Netherlands houses experts in mechanical, electrical, software, process, and mold/tool design, working collaboratively to achieve the best total system solution. The production site in Singapore, established in 1997, has gradually developed local capabilities for manufacturing the molding and sinter systems. Notably, the last investment in the company was a Private Equity Round in 14 March 2017 led by Holland Capital. Overall, Boschman Advanced Packaging Technology is positioned as a dynamic high-tech company with a solid track record serving the semiconductor assembly industry, and its partnership with Holland Capital demonstrates the confidence of prominent investors in the company's potential.