aiXscale Photonics GmbH

Uniquely enabled by waferscale precision glass molding technology, aiXscale Photonics supplies proprietary ultra-high precision optical glass interposer solutions for reliable, low loss and cost effective assembly of transceiver optical subassemblies and co-packaged optics. We serve the needs of current and next generation high-volume Datacom and Telecom applications. Want to make your custom Photonic Integrated Circuit (PIC) a plug & play device? We provide scalable and low cost optical interfacing to a standard MPO connector. aiXscale Photonics was founded in 2017 by Jeremy Witzens and Florian Merget as a spin-off from the Institute of Integrated Photonics of RWTH Aachen University, Germany.